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FULL DESCRIPTION of Item 120396

in Manual Flip Chip Bonders
Item ID: 120396

Offered 1 Offered at Best Price


K&S 6497

Semiautomatic Flip Chip Die Bonder
K&S 6497
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Location: Plano, TX, United States
Unit Price Unstated
Number of Units 1
Manufacturer Kulicke & Soffa
Model 6497
Description Semiautomatic Flip Chip Die Bonder
Other Information 
  • ±1.2 Mil @ 3 Sigma Placement Accuracy
  • 50 to 3000 grams Bond Force Range
  • 10sq. mil – 1000sq.mil Die Size Range
  • 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution
  • 0.2 mrad/motor pulse Theta Rotation