| Other Information |
- Serial Number DA0201-310006 Date of Mfg: 2000
- Attaches Solder Balls to Work Surface by Irradiating it with Laser Light
- Automatic Material Handling System
- 50mm (X) x 50mm (Y) Placement Area
- 100,000 Balls Placed Per Process Program
- 100 – 800 um (dia) Ball Size Range
- 150 Alignment Points per Process Program
- 100 Reference Points per Process Program
- Pattern Recognition System
- Class 1 Laser System with Embedded Class 4 Laser
- 915 nm Output Wavelength
- 40 Watts Maximum Output Power – Class 1 Laser System
- 8 Watts Maximum Output Power – Embedded Laser Diode (continuous-per diode)
- 0 to 100 msec Pulse Duration – Programmable in 0.1 msec increments
- 115V 27 Current(A) 50/60 Hz 1 Phase
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