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FULL DESCRIPTION of Item 3317

in Automatic Epoxy Die Bonders
Item ID: 3317

Offered1 Offered at Best Price


Alphasem Swissline 9006

Automatic Epoxy Die Bonder
Alphasem Swissline 9006
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Location: Plano, TX, United States
Unit Price Unstated
Number of Units 1
Manufacturer Alphasem
Model Swissline 9006
Description Automatic Silver-Glass Die Attach (Hermetic Package)
Other Information 
  • Serial Number 516 Date of Manufacture: 5/93
  • Volumetric Silver-Glass Dispense System With "Star Fish" Dispense Tool
  • PGA, Cerdip, LCC and Side Brazed Packages
  • Up to 200 mm (8") Wafers
  • 0.25 – 18 mm (10 – 750 mil) Die Size
  • 25 – 400 gr Pick/Bond Force
  • 0 – 10 secs Bond Time
  • 0.5 secs Cycle Time
  • Programmable Pitch and Adjustable Boat Width of 2", 3.1" or 4.3" With Universal Roller-Boat Feed System
  • Multi-magazine Input/Output
  • Quick Lock Vacuum Chucks
  • Cavity Depth Sensor for Automatic Adjustment of the Silver-Glass Bond Layer Thickness
  • Inline Automatic Jumper Chip Attach Unit
Condition Good
Year of Manufacture 1993
Refurbished YES
Exterior Dimensions 
  Width 58.000  in  (147.3 cm)
  Depth 42.000  in  (106.7 cm)
  Height 72.000  in  (182.9 cm)