Item ID: 229872 1 Offered at Best Price Microautomation M-1100 Wafer Dicing Saw Microautomation M-1100 Wafer Dicing Saw Location: Plano, Texas, United States Unit Price Unstated Number of Units 1 Manufacturer Micro Automation Model M-1100 Maximum Substrate Diameter 6.000 in (15.2 cm) Spindle Type Air Bearings Condition Excellent Make OFFERSend QUESTIONS
Microautomation M-1100 Wafer Dicing Saw