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in Diamond Scribers
Item ID: 53280

Offered 1 Offered at Best Price

Dynatex DX III

Wafer Scriber/Breaker

Dynatex DX III
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Location: Plano, Texas, United States
Unit Price Unstated
Number of Units 1
Manufacturer Dynatex
Model DX III
Description Wafer Scriber/Breaker
Other Information 
  • For Scribing & Breaking of up to 4” Wafers
  • Chip Free™ Breaking Mechanism Uses Impact Breaking System
  • Minimum Die Size: 0.005” Square (125µ)
  • Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ)
  • CCD Camera Alignment System
  • Internal PC Control System Incomplete - No HDD
  • Facilities Required:
    • Input Voltage: 115VAC, 60Hz, 5A
    • CDA or N2: 60-85 PSIG, 0.5 CFM
    • Vacuum: 15-28 In. Hg, 0.5 CFM