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FULL DESCRIPTION of Item 229872

in Dicing Saws
Item ID: 229872

Offered 1 Offered at Best Price


Microautomation M-1100 Wafer Dicing Saw

Microautomation M-1100 Wafer Dicing Saw


Location: Plano, Texas, United States
Unit Price Unstated
Number of Units 1
Manufacturer Micro Automation
Model M-1100
Maximum Substrate Diameter 6.000  in  (15.2 cm)
Spindle Type Air Bearings
Condition Excellent